High precision. The manufacture of semiconductor equipment requires high-precision technical support, including wafer processing and precision circuit design, which can realize sub-micron processing technology.
High stability. The stability requirements of semiconductor devices are very high, and only high stability can be achieved to ensure that the manufactured chip has stable performance and long life.
High difficulty. The manufacturing process of semiconductor devices is very complex, requiring strict control of all aspects of the manufacturing process.
High efficiency. The development of semiconductor technology has brought about a great increase in production efficiency, requiring semiconductor equipment manufacturers to have efficient manufacturing processes.
Interdisciplinary integration. There are many types of semiconductor equipment parts and components, covering a wide range. R & D, design, manufacturing and application involve the cross integration of materials, machinery, physics, electronics, precision instruments and other disciplines.
Fragmentation features are evident. The semiconductor parts market has more branches, the characteristics of fragmentation are obvious, the market space for a single product is very small, and the technical threshold is high.
High reliability. The semiconductor device can respond quickly and has higher reliability than conventional devices because there are no mechanical parts.
Miniaturization. Semiconductor devices are lightweight and miniaturized, allowing them to be more easily integrated into the circuit board, thereby reducing the size of the circuit board.
Flexibility in chip design. The design of semiconductor chips is very flexible and can be designed into chips of various shapes and styles to suit various applications.